ステークカジノの評判 - 入金不要ボーナス・入金方法かんたん ...

Products Technologies Corporate Profile Contact Us Metals for Environment and Energy Clad metals for batteries Metals for batteries Clad metals for heat exchangers Metals for Automobiles Clad metals for rechargeable batteries Clad metals for batteries Clad metals for heat spreaders Materials for resistors Bimetals Temperature compensator alloys Permalloys Copper phosphorus brazing filler metal/Copper clad Copper-clad stainless steel Joining materials Metals for Communications, Semiconductors and Packages Iron-Nickel-Cobalt alloys Iron-Nickel alloys Low thermal expansion alloys for precision equipment Permalloys Clad metals for heat spreaders Metals for laser diodes Clad metals for smartphones Bimetals Metal parts for package sealing Au coated Ni-P particles Lead pins Metals for functional parts Copper alloy strip for semiconductor lead frames Dual gauge copper strip Plated copper strip and dual gauge copper strip Copper strip for heat sinks and heat spreaders Copper strip for ceramic substrates General industry Copper bar, copper rod, formed bars, hollow conductors Fabricated products Copper strip for industrial applications Oxygen-free copper rods containing zirconium Oxygen-free copper Class 1 Metals for Domestic Electrical Applications Lead frame materials for LEDs Iron/Copper clad Clad metals for button-type batteries Bimetals Temperature-sensitive magnetic materials Permalloys Clad metals for conductive springs Temperature compensator alloys Metals for information technology devices Stainless steels for heater applications Metals for Special Applications Corrosion-resistant alloys/Heat-resistant alloys Low thermal expansion alloys Alloys for high tensile strength springs Material technologies Material technologies Extremely thin metallic foils (High-precision rolled foils) Processing technology Forming modified cross-section shape Machining Bending Welding Punching Drawing press Heading Metal ball manufacturing process Brazing Magnetic annealing Surface treatment technologies Plating(Fine processed products、Strip) Plating on hoops and extremely thin metallic foils Corporate Profile Message from the President --> Corporate Summary and History Major Offices and Access Map Proterial Group Codes of Conduct CSR Activities of Proterial Group Companies Environmental Activities Quality Management Cautions Regarding Product Use Contact Us Contact Us Japanese Products Technologies Corporate Profile Contact Us Proterial Metals, Ltd. TOP > Products > Metals for Communications, Semiconductors and Packages > Au coated Ni-P particles Metals for Communications, Semiconductors and Packages ●Au coated Ni-P particles 【Features】 Packaging technologies for those devices have also been evolving towards higher performance and higher density.  We manufacture these highly conductive fine particles of uniform size by wet reduction method, which was developed jointly by Group Company and Akita Prefectural Resources Technology Development Organization. It is a potential technology that enables the higher performance and higher density required for next-generation electronic components. 【Product image】 【Applications】 ・Display / Semiconductor Package Components and Spacer 【Technology】 ・Metal ball manufacturing process ・Plating(Au, Ag, Solder etc.) 【Usage example】 【Technical report】 Demand for erectric devices, including smartphones and tablet PCs, has been growing rapidly. It is expected to continue growing, mainly in emerging countries. Erectric devices are evolving towards higher resolutions, multifuntional, and lower profiles. Packaging technologies have also been evolving further towards higher performance and higher density. In this trend, there is a growing demand for precise gap control between substrates and IC chips and anisotropic conductive connections between substrates. From collaboration with Akita Prefectural Resources Technology Development Organization, Our group company has developed a wet reduction method for manufacturing spherical metal particles. As shown in Figure 1, the particles having smooth surface are completely spherical, uniform in size, and highly dispersive. The limited variation in the particles is also apparent from the result of the measurement of particle size distribution with the laser diffraction method shown in Figure 2. In addition, conductive fine particles are required to maintain stable conductivity, even in a harsh environment. In response, we have established a uniform Au plating technology to plate large quantities of fine Ni-P particles having large specific surface area, which has been deemed difficult. It can be confirmed from a cross-sectional image of the film formation of Au plating, which is shown in Figure 3, that an Au plating layer of an even thickness is formed on the particle surface. And it was confirmed in an accelerated test (125ºC/95 RH%, 0.2 MPa; RH stands for relative humidity), by which we evaluated the changes of particles, that the volume resistivity increases only around two times compared to the initial resistivity even when the Au film around the particle is extremely thin at 15 nm or 30 nm (Figure 4). Cuurently, we can offer fine unified particles with high conductivity and high corrosion resistance plating in the range of 1-20μm in diameter. Please feel free to make an inquiry. Products Metals for Environment and Energy Clad metals for batteries Metals for batteries Clad metals for heat exchangers Metals for Automobiles Clad metals for rechargeable batteries Clad metals for batteries Clad metals for heat spreaders Materials for resistors Bimetals Temperature compensator alloys Permalloys Copper phosphorus brazing filler metal/Copper clad Copper-clad stainless steel Joining materials Metals for Communications, Semiconductors and Packages Iron-Nickel-Cobalt alloys Iron-Nickel alloys Low thermal expansion alloys for precision equipment Permalloys Clad metals for heat spreaders Metals for laser diodes Clad metals for smartphones Bimetals Metal parts for package sealing Au coated Ni-P particles Lead pins Metals for functional parts Copper alloy strip for semiconductor lead frames Dual gauge copper strip Plated copper strip and dual gauge copper strip Copper strip for heat sinks and heat spreaders Copper strip for ceramic substrates General industry Copper bar, copper rod, formed bars, hollow conductors Fabricated products Copper strip for industrial applications Oxygen-free copper rods containing zirconium Oxygen-free copper Class 1 Metals for Domestic Electrical Applications Lead frame materials for LEDs Iron/Copper clad Clad metals for button-type batteries Bimetals Temperature-sensitive magnetic materials Permalloys Clad metals for conductive springs Temperature compensator alloys Metals for information technology devices Stainless steels for heater applications Metals for Special Applications Corrosion-resistant alloys/Heat-resistant alloys Low thermal expansion alloys Alloys for high tensile strength springs Material technologies Material technologies Material technologies Extremely thin metallic foils (High-precision rolled foils) Processing technology Forming modified cross-section shape Machining Bending Welding Punching Drawing press Heading Metal ball manufacturing process Brazing Magnetic annealing Surface treatment technologies Plating(Fine processed products、Strip) Plating on hoops and extremely thin metallic foils Corporate Profile Message from the President --> Corporate Summary and History Major Offices and Access Map Proterial Group Codes of Conduct CSR Activities of Proterial Group Companies Environmental Activities Quality Management Cautions Regarding Product Use Contact Us PAGE TOP Corporate Profile Message from the President > --> Corporate Summary and History > Major Offices and Access Map > Proterial Group Codes of Conduct > CSR Activities of Proterial Group Companies > Environmental Activities > Quality Management > Cautions Regarding Product Use > Contact Us > About Personal Information Protection | Sitemap | Proterial Metals Website Terms of Use COPYRIGHT ©Proterial Metals, Ltd. 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